This cross industry conference facilitates technical discussions and explores new opportunities for leveraging the packaging industry to fulfill the growing e-commerce market, E-PACK US
returns for a third year, to support the packaging industry in the transition from in-store packaging to e-commerce packaging. This event provide a platform for the packaging supply chain to come together to share ideas and discuss challenges and solutions in e-commerce packaging.
Packed with first-hand experience, leading brands and retailers will be sharing their insights, best practice and lessons learned on their e-commerce packaging journeys, E-PACK US provides the perfect platform to stay ahead of the latest trends and developments in the e-commerce packaging market. Through a mix of case studies, interactive panel discussions and thought-leadership, the experts will help you to find solutions to your problems.
We are excited to announce that we have made the decision to transform E-PACK US 2020
into a fully virtual event.
We believe this is the best option to provide our attendees, speakers, and sponsors with the certainty they need to plan their participation and maximize the value from the event in a safe and reliable way.
During the online event, attendees can expect to:
- Hear from key industry players and thought leaders as they share their expert insights into the the latest trends and developments, case studies, and lessons learned
- Network and connect with fellow delegates, speakers, and sponsors via our customized online event platform
- Have your questions answered during dedicated Q&A sessions.
- Access proceedings after the event so you don't miss a thing!
E-PACK US provides a welcoming and collaborative platform for representatives from the entire supply chain - including brand owners, conventional/online retailers, packaging converters, material and equipment suppliers, packaging designers, machinery manufacturer, delivery services, recyclers, regulators, research companies, software supplier, associations, and more.